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XTL Sintyron High Temperature PCB Copper Clad Ceramic Substrate for Automotive Applications

Artikel Einheit Performance
Thickness mm 0.127/0.2/0.25/0.3/0.4/0.5/0.8
Oxygen Content % ≤0.001
Surface Hardness HV3 90-120（Post-Copper Cladding:45-55）
Conductivity MS/m 58.6

Tel: +86 13975373343
E-Mail: sales01@sintyron.com

XTL Sintyron High Temperature PCB Copper Clad Ceramic Substrate for Automotive Applications
XTL Sintyron High Temperature PCB Copper Clad Ceramic Substrate for Automotive Applications – Bild 2
XTL Sintyron High Temperature PCB Copper Clad Ceramic Substrate for Automotive Applications – Bild 3
XTL Sintyron High Temperature PCB Copper Clad Ceramic Substrate for Automotive Applications – Bild 4

17 Jahre Experte für industrielle Keramik – wir schätzen Ihre Anfrage.

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sales01@sintyron.com

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+86-13975373343

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Shentan-Industriegebiet, Stadt Liling, Provinz Hunan, China

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Liling Xing Tai Long Special Ceramic Co.,Ltd

Plus:Shentan-Industriegebiet, Stadt Liling, Provinz Hunan, China

Tel: +86-13975373343   Email-Adresse: sales01@sintyron.com