Feuille de céramique isolante électrique en nitrure d’aluminium XTL Sintyron

Product descritption:

One of the key advantages of using aluminum nitride as a substrate material is its high thermal conductivity.

With a thermal conductivity of around 170 W/mK, AlN outperforms traditional substrate materials such as

alumina and silicon carbide, making it an excellent choice for highpower electronic devices that generate a

significant amount of heat. This high thermal conductivity allows for efficient heat dissipation, which is

crucial for the reliability and performance of electronic components.

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