XTL sintyron 170 high thermal conductivity aluminum nitride substrate

Aluminum Nitride Substrate feature：
1.The thermal conductivity of aluminum nitride ceramic substrate is very high, 5 times that of alumina ceramic substrate, the crystal is AIN, strong hardness, good insulation, high temperature resistance and corrosion resistance.
2.The thermal conductivity (thermal conductivity) of aluminum nitride ceramic substrate is greater than or equal to 170W/m.k.,
and the thermal conductivity of aluminum nitride ceramic substrate is that of alumina ceramic substrate and silicon nitride ceramic substrate.
3.Aluminum nitride ceramic substrate without FR4 plate can be very long and large, the size is relatively small, the maximum size of the general aluminum nitride ceramic substrate material is 110mm*140mm, aluminum nitride ceramic substrate is a ceramic base, easy to break, do too big too long does not meet the characteristics of the substrate.
4.Aluminum nitride ceramic substrate dielectric loss is very low, in 0.0002, coupled with the coefficient of thermal expansion is also very low (4.6~5.2), dielectric loss is small, energy consumption is small, high temperature corrosion resistance, durable.
5.The dielectric constant of aluminum nitride ceramic substrate is generally 9.0, which is 0… 8, low dielectric constant, means better quality.
6.Flexural strength refers to the ability of a material to resist bending without breaking, which is mainly used to investigate the strength of brittle materials such as ceramics. The bending strength of the aluminum nitride ceramic substrate is 450Mpa, and the bending strength of the alumina ceramic substrate is 400Mpa, which means that the aluminum nitride ceramic substrate can withstand more pressure and tension.
7.The ability of a material to resist other hard objects pressing into it and causing dented deformation. Commonly used hardness units are Brinell hardness (HB or BHN), Vickers hardness (Hv or VHN), Rockwell hardness (HRA, HRC or RHN) and Knower hardness (HK or KHN). The surface hardness of a material is the result of its strength, proportional limit, toughness, ductility, abrasion resistance, cutting resistance and other properties. The fracture toughness of aluminum nitride ceramic substrate is 3.0Mpa m1/2.
8.Aluminum nitride ceramic substrate is brittle, although the hardness is stronger than the alumina ceramic substrate, the alumina ceramic substrate is white, and the aluminum nitride ceramic substrate is grayish white. The surface roughness of aluminum nitride ceramic substrate is generally required to be less than 10 N.

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